For Advanced pcbs ,Here are partial typical technologies pcb we built, If you need others advanced pcbs, pls contact us ,Our high technology team will solve any issue for you as we always understand for customer special characteristic design. We do not think you need to contact many pcbs vendors for various special pcbs and consumes your time, just need to contact us to meet your demand.
| PCB Types | Technologies | Product Apppicaton |
| RF/Microwave PCB | High frequency composite PCB technology | Antenna, antenna array, directional coupler, powerdivider, filter, LNA, LNB, automobile radar |
| Multiple laminated technology | ||
| Coin | ||
| Cavity | ||
| Backdrill | ||
| Impedence control | ||
| Via on padCopper paste in via | ||
| High Multi-Layer PCB | Multi-layer laminationHigh | Antenna, antenna array, directional coupler, powerdivider, filter, LNA, LNB, automobile radar |
| High aspect ratio PCB plating | ||
| High frequency hybrid PCB technology | ||
| BackdrillImpedence control | ||
| Multiple laminated technology | ||
| HDI PCB | POFV | Mobile phones, smart watches, consumer electronics, wearing devices, etc. |
| Multiple laminated technology | ||
| Impedence control | ||
| Laser drill | ||
| High-density circuit | ||
| Cavity | Depth control | Automotive Electronics, High Current Circuit,Power Amplifier, High Speed OpticalCommunication Transmission, Electric Hybrid Computer, Radio Frequency and Microwave ApplicationsVehicle, Motor Control Module, High Speed |
| Excessive gule control | ||
| Laser slotting | ||
| Multiple laminated technology | ||
| High frequency hybrid PCB technology | ||
| Conductive Copper Paste | Copper paste in via | Automotive Electronics, Automotive BatteryManagement, High Speed Industrial Computer,Radio Frequency and Microwave Applications |
| VIA on pad | ||
| Abrasive band grinding | ||
| High frequency hybrid PCB technology | ||
| Backdrill | Depth control drilling | High Frequency and High Speed Products, Server,Medical Electronics, Military Applications,Communications Equipment |
| High frequency hybird | ||
| High multi-layer | ||
| Multiple laminated technology | ||
| Rigid-Flex PCB | Single&Double sided flexible PCB | Consumer electronics, Contractmanufacturing, High-speed digitaldevelopment,Instrumentation,LEDs andlighting,Power electronics, RF and microwaveequipment,and other industrial applications |
| Single FPC symmetrical structure | ||
| Multiple FPC book structure | ||
| Multiple FPC laminated structure | ||
| Flying tail structure | ||
| Upper and lower asymmetrical structure | ||
| Left and right asymmetric structure | ||
| Unilateral asymmetric structure |