Air Gap Flex-Rigid PCB

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Air Gap Flex-Rigid PCB

Air Gap Flex-Rigid  PCB are An Innovative

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Air Gap Flex PCBs are an innovative and specialized type of printed circuit board, setting themselves apart from traditional designs. An air gap, as the name implies, is a space or void between different layers of the flexible PCB. This distinct feature provides several unique advantages.

In the construction of Air Gap Flex PCBs, the air gap acts as a natural insulator. Made with flexible materials like polyimide, which is highly resistant to heat and mechanical stress, the layers are separated by this air gap. This insulation property helps in preventing unwanted electrical interference between adjacent layers. When signals travel through the traces on different layers, the air gap significantly reduces crosstalk, ensuring that each signal remains clear and undisturbed.

The flexibility of these PCBs is further enhanced by the air gap. The air - filled space allows the board to bend and flex more freely without the risk of short - circuits or damage to the internal traces. This makes them ideal for applications where the PCB needs to be frequently bent or twisted, such as in wearable electronics, where the device must conform to the shape of the human body.

Moreover, the air gap can also improve the thermal performance of the PCB. In electronic devices, heat is a common by - product, and effective heat dissipation is crucial for the device's long - term reliability. The air gap acts as a heat buffer, allowing heat to dissipate more evenly across the board. This is especially beneficial in high - power applications where excessive heat can cause components to malfunction.

The design flexibility offered by Air Gap Flex PCBs is another major advantage. The air gap enables a more complex layout of components and traces. Manufacturers can place components in a more strategic manner, taking full advantage of the available space on the board. This results in a higher component density, which is essential for creating compact and powerful electronic devices.

Due to these remarkable features, Air Gap Flex PCBs are in high demand in various industries. In the automotive sector, they are used in in - car infotainment systems and advanced driver - assistance systems, where the need for flexible, reliable, and interference - free PCBs is crucial. In the consumer electronics industry, they find applications in foldable smartphones and tablets, providing the necessary flexibility and performance for these cutting - edge devices.

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Air Gap Flex-Rigid PCB

Here are stacks up of normal 6 Layers rigid-flex circuits (1L FR4 PCB +2L FPC+Air Gap +2L FPC+1L FR4 PCB) and you can see, there are  Air Gap between Flex parts. 
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Air gap flex circuits have been gradually emerging and gaining traction in various high - end industries in recent years. While traditional flex circuits focus mainly on bendability and electrical connectivity, air gap flex circuits introduce a unique element - the air gap. We can also manufacture many air gaps between many layers
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Contact us for  more stacks up of Air Gap flex-rigid circuit boards . 

If you are interested in exploring the potential of Air Gap flex-rigid PCBs for your next project, don't hesitate to contact us. We have extensive experience in manufacturing and engineering these advanced circuit boards and can offer a variety of stack - up options to meet your specific requirements. Our team of experts is ready to assist you in leveraging the power of Air Gap flex-rigid technology to take your product to the next level.

Vantage of Air Gap Flex-Rigid PCB

  • Exceptional Electrical Isolation

    In air gap flex-rigid PCBs, the presence of an air gap between layers serves as an outstanding insulator. This air barrier effectively prevents unwanted electrical coupling between different layers. When compared to traditional PCBs, the air gap greatly reduces capacitive and inductive interference. This makes air gap flex-rigid PCBs ideal for applications where signal purity is crucial, such as in high-frequency communication equipment like satellite transceivers and advanced radar systems.

  • Heightened Flexibility and Durability

    The air gap significantly enhances the flexibility of flex-rigid PCBs. It allows the flexible sections to bend and twist more freely, with reduced risk of fatigue or damage to the internal circuitry. The design ensures that even after repeated flexing, the integrity of the traces and components remains intact. This makes these PCBs highly suitable for applications where long - term flexibility is required, such as in robotics with moving parts and flexible display modules.

  • Improved Thermal Management

    Air gap flex-rigid PCBs offer superior thermal performance. The air gap acts as a natural heat dissipater, promoting better heat transfer across the board. In high-power applications, heat can be more evenly distributed and dissipated, preventing hotspots that could potentially damage components. This is especially important in industrial equipment, where continuous operation at high temperatures is common.

  • Enhanced Design Freedom

    The air gap provides designers with greater flexibility in creating complex circuit layouts. Components can be arranged more efficiently, taking full advantage of the available space on both the rigid and flexible parts of the board. This leads to higher component density and more compact designs. For example, in the design of miniaturized medical implantable devices, air gap flex-rigid PCBs enable the integration of multiple functions in a small form factor.

  • Lightweight Construction

    Thanks to the use of an air gap, these PCBs can achieve a lightweight design. The reduced material usage not only cuts down on weight but also contributes to cost savings. In industries where weight is a critical factor, such as aerospace, the lightweight nature of air gap flex-rigid PCBs can improve fuel efficiency and overall performance of the aircraft.

  • Incorporation of Advanced Features

    Similar to other advanced PCBs, air gap flex-rigid PCBs can integrate features like impedance control, electromagnetic interference (EMI) shielding, and surface mount technology (SMT) assembly. These features further enhance the performance and functionality of the boards, making them suitable for a wide range of high-tech applications, from consumer electronics to military equipment.


Rigid-Flex PCB Capability
As a professional manufacturer of rigid flexible circuit board in China, We always try to improve our capability to produce more rigid-flex circuit board to our customers. Here is major capability: 
  • 1-10 flexible layers; multiple flex layers in either bonded or air gap configuration
  • 1-40 rigid layers
  • 2-50 layer rigid flexible circuits
  • Flex Core Materials: Polyimide (PI): 1/2 mil to 4 mils in either adhesive or adhesives constructions
  • Copper thickness: 1/3 OZ – 2 OZ RA or ED type (insert material/copper-foil.htm) in flexible circuit; 1/2OZ to 10 OZ in rigid circuits;
  • Coverlays: 1/2 mil to 2 mils polyimide
  • Stiffeners material: polyimide, FR4, stainless steel, aluminum
  • Rigid Materials: 130, 170, 180 TG FR4, low flow prepreg
  • EMI/RF shielding films
  • Blind and buried vias available
  • Any layer available 
  • Controlled impedance: 50 ohm, 90 Ohm, 100 Ohm, 110 Ohm and other value
  • Surface finishing: ENIG, ENEPIG, gold plating, gold fingers (3-30u” Au), Immersion silver
  • IPC 6013 – Class II & Class III available

 
Rigid-Flex PCB Manufacturing Process

Manufacturing of rigid-flex PCB is much more complicated than other types of flexible circuit, here are simple manufacturing steps for your reference:

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I-Tech provides various sizes of rigid flexible Circuit boards, of different layers. All Rigid-Flex Circuits are tested with electronic testing reflecting all Gerber data to ensure continuity and other data requirements. 
We can provide fast prototypes within 3-7 days, on-time delivery, great quality for you. Please contact us today for more information about rigid flexible circuits.


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