Air Gap Rigid-Flex PCBs

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Rigid-Flex Air Gap PCBs

Air Gap Rigid-Flexbile Circuits

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Air Gap Rigid-Flex PCBs are a cutting-edge innovation in the world of printed circuit boards. They offer a unique combination of rigidity and flexibility, with a distinctive air gap feature that sets them apart.


The air gap within these PCBs provides enhanced electrical insulation and reduced capacitance, allowing for improved signal integrity and higher performance. This is particularly crucial in applications where precise and reliable signal transmission is essential, such as in advanced communication devices and high-frequency electronics.


In the aerospace industry, Air Gap Rigid-Flex PCBs can withstand extreme temperatures and vibrations, ensuring the stability and reliability of critical systems. For example, in satellite communication modules, they play a vital role in maintaining clear and uninterrupted signal transmission.


In the medical field, their flexibility and compact design make them ideal for portable and wearable diagnostic devices. They can conform to the shape of the device while maintaining the integrity of the circuitry.


However, the manufacturing process of Air Gap Rigid-Flex PCBs is complex and requires advanced technologies and precise control. This often leads to higher production costs and longer lead times.


Despite these challenges, the advantages offered by Air Gap Rigid-Flex PCBs make them a promising solution for demanding applications, and ongoing research and development efforts are likely to further enhance their performance and affordability in the future.


Air Gap Rigid-Flex PCBs: Unleashing New Possibilities


Air Gap Rigid-Flex PCBs represent a significant advancement in the field of electronics. Their unique structure, featuring an air gap, provides several key benefits that are driving their adoption in various industries.


The air gap helps to minimize crosstalk and electromagnetic interference, enabling more accurate and efficient data transfer. This is especially valuable in complex systems like automotive electronics, where multiple components need to operate seamlessly.


In the defense sector, these PCBs are used in sophisticated radar and communication systems, where their reliability and performance under harsh conditions are paramount.


For consumer electronics, Air Gap Rigid-Flex PCBs enable the creation of thinner, lighter, and more flexible devices. Imagine a foldable smartphone with a seamless connection and enhanced functionality thanks to this technology.


While the production of these PCBs poses technical challenges, the continuous improvement in manufacturing techniques is gradually overcoming these obstacles. As a result, we can expect to see even wider applications of Air Gap Rigid-Flex PCBs in the years to come.

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Multilayer Rigid-Flexible Air Gap Circuits（Multilayer FPC,Multilayer Flex PCB)

 

When To Use & Feature Of Multi-Layer Flex

Eliminating the need for complex welding processes, multi-layer flex circuit boards have significant functional differences in terms of higher reliability, better thermal conductivity, and more convenient assembly performance. They also have excellent electrical properties such as a low dielectric constant. Therefore, multi-layer flexible circuits are an effective solution when the following purposes and characteristics are required:

  • Unavoidable crossovers
  • Elimination of crosstalk
  • Ground and power plane applications
  • Used for EMI, RF shielding applications
  • Through-hole assembly
  • Specific impedance controlled
  • Up to 10 or more conductive layers
  • Unbonded regions to increase flexibility in bend region
  • Increased circuit density: Multilayer high circuit density system can handle multiple conductive layers to save space
  • High components density
  • Other customer-specified electrical requirements
  • Ideal for the aerospace and defense markets

 

Multi-Layer Flex AIR GAP Circuit Structure / Stack Up


Here is stack up of a normal  6 layers Rigid +4 layers AIR GAP  flexible circuit:
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There are more complex interconnections, layer design surface mounting. Contact us  to see more stacked multi-layer flex circuits.

Multi-layer flexible printed circuit boards can be further classified into the following types:


Unbonded/Separated stack up: Each layer or several layers are separated from one another in the central portion. Thus, they are unbonded in the center area and electronically connected at both ends of the flexible circuit. The flexibility is much better than that of the normal stack-up. Which is also called "Air Gap".

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Multi-Layer Rigid-Flex AIR GAP Circuit Materials:


Multi-layer flex also allows for localized areas where stiffeners, pins, connectors, and components may be added, so the material is the same as double-sided flex circuits, all have core material, coverlay, stiffeners, PSA EMI/RF shielding.

 

Advantages of Rigid Flex Circuit


  1. High-Density Applications: The rigid area of a rigid flex circuit is employed for high-density device placement. Additionally, finer line widths and spacings are permitted in flexible circuits, enabling higher density. Denser device layouts and lighter conductors can be incorporated into a product, creating space for additional product features.

  2. Broader Applications: Advances in rigid circuit board technology have expanded the applications of electronic products, ranging from communication, computer, and consumer electronics to medical, automotive, and military electronics.

  3. The increasing demand for more powerful and smaller products drives the need for multiple layers to accommodate denser, finer line widths and spacings, and smaller hole sizes.

  4. Highly Complex Configurations

  5. Fewer Electronic Components Required

  6. Reduced Interconnections

  7. Reduced Package Size and Weight

  8. Furthermore, the air gap widely utilized in multi-layer flex circuits can also be employed, and other features such as controlled impedance (insert impedance-control.htm), EMI shielding, panelization, stiffeners, PSA, and Circuit Assembly (SMT) are also available.








 

Rigid Flexible Circuit Capability


  1. As a professional manufacturer of rigid flexible circuit board in China, We always try to improve our capability to produce more rigid-flex circuit board to our customers. Here is major capability: 

  2. 1-10 flexible layers; multiple flex layers in either bonded or air gap configuration

  3. 1-32 Rigid layers

  4. Flex Core Materials: Polyimide (PI): 1/2 mil to 4 mils in either adhesive or adhesives constructions

  5. Copper thickness: 1/3 OZ – 2 OZ RA or ED type (insert material/copper-foil.htm) in flexible circuit; 1/2OZ to 10 OZ in rigid circuits;

  6. Coverlays: 1/2 mil to 2 mils polyimide

  7. Stiffeners material: polyimide, FR4, stainless steel, aluminum,copper

  8. Rigid Materials: 130, 170, 180 TG FR4, low flow prepreg

  9. EMI/RF shielding films

  10. Blind and buried vias available

  11. Any layer available 

  12. Controlled impedance: 50 ohm, 90 Ohm, 100 Ohm, 110 Ohm and other value

  13. Surface finishing: ENIG, ENEPIG, gold plating, gold fingers (3-30u” Au), Immersion silver

  14. IPC 6013 – Class II & Class III available

  15. Customer Quality Standard is Top Priority, We Fully understand for The Special Characteristic and Requirement from Customer,Which is Identified by Our engineering Team and QA  Customer Standard Team.


Rigid Flex Circuit Manufacturing Process:

Manufacturing of rigid-flex PCB is much more complicated than other types of flexible circuit, here are simple manufacturing steps for your reference:

Manufacturing of rigid-flex PCB steps for your reference:

We offer a wide range of sizes of rigid flexible circuit boards with different layers. All Rigid-Flex Circuits are subjected to electronic testing that reflects all Gerber data to ensure continuity and meet other data requirements.


We can provide fast prototypes within 3 to 7 days, ensure on-time delivery, and guarantee excellent quality for you. Please contact us today for more information about rigid flexible circuits.

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