Company Technologies
When it comes to PCB fabrication, I-TECH is absolutly one who is worth to understand.Curious our capabilities? Dive right in and check them out now! Our distinct edge in PCB manufacturing is propelled by a technical professional founder.
We're not just talking about run - of - the - mill production. With the capability to handle up to 50 layers, a board thickness stretching to 10 mm, a minimum line width/space of 2/2 mil, a minimum hole size of 0.2 mm, a laser hole as small as 3 mil, advanced 9+N+9 HDI technology, POFV (Plating flating, filling resin ), copper - filled vias, high - speed and high - frequency materials, an impedance tolerance of 5%, and a wide array of surface treatments, we've set the bar high in the industry. Take a look at the detailed capability overview and display below to get a better sense of our prowess.
Should any questions or doubts cross your mind while exploring our offerings, don't hesitate to get in touch with us. We're here to clarify every query.
At I-TECH, we're committed to turning all your PCB - related needs into tangible, high - quality products. All you have to do is reach out and share the specifics of what you're looking for. Whether it's pre - sale advice or post - sale support, our dedicated team is always ready to serve you with the utmost professionalism.
Item | Standard | Advanced | Item | Standard | Advanced | ||
Max Layer Count | Rigid | 32 | 50 | Copper Weight | 1/5oz - 10oz | 1/7oz - 12oz | |
Flex | 6 | 10 | Hole(min) | Mechanical | 200um | 150um | |
Rigid-Flex | 20 | 50 | Laser | 100um | 100um | ||
Thickness | Rigid | 0.2mm - 10mm | 0.1mm - 14mm | Vias' Pad | Mechanical | 350um | 300um |
Flex | 0.08mm - 0.8mm | 0.06mm - 1.0mm | Laser | 250um | 200um | ||
Size | Width | 10.0mm - 800.0mm | 3.0mm - 900.0mm(Multi800) | Hole Aspect Ratio | 1:16 | 1:18 | |
Length | 10.0mm - 1500.0mm | 3.0mm - 2100.0mm(Multi1320) | Min Deletric Thickness | Inner Core | 0.025mm | 0.025mm | |
Tracks | Width | 70um | 50um | Prepreg | 0.05mm | 0.05mm | |
Gap | 70um | 50um | HDI | 5 + N + 5 | 9 + N + 9 | ||
Via Filling(with) | Soldermask/Resin/plating/copper & silver paste | Solder Mask Bridge | 75um | 60um | |||
Embedded Passive | Capacitor | 3M C-Ply, Dupont HK04J,Sammina (BC-2000), Mitsu Faradflex,OKA-Mitsui,Faradflex BC12M, BC24M | Materials | Standard FR4,lead free compatible | |||
Resistor | Resistance(ohms/sq):25,50,100,200;Ohmega-Ply,Asahi Tu-50/1000-08, Ticer, Nichrome | ||||||
Materials | Burried Copper/Ceramic/Coin/Steel/other metal/Components | Surface Treatment | Soft gold | ||||
Tolerance(+/-) | Hole | 0.075mm | 0.025mm | ||||
Slot | 0.1mm | 0.05mm | |||||
Tracks | 15% | 10% | |||||
Outline | 0.1mm | 0.08mm | |||||
Impedance | 8% | 5% | |||||
Dielectric | 15um | 10um | |||||
Depth Control | 150um | 100um | |||||