HDI Rigid- Flexible Circuits
HDI RIGID-FLEX PCB combines the rigidity of traditional circuit boards with the flexibility of flex circuits. It consists of both rigid and flexible sections, allowing for complex designs and enhanced functionality.
This unique board structure uses advanced manufacturing techniques to ensure efficient signal transmission and reliable connections. Metalized holes and vias enable seamless communication between layers.
In applications like wearable devices, it offers a perfect fit and stable performance. For example, smartwatches benefit from its flexibility and compact design.
In automotive electronics, it withstands harsh conditions and provides reliable circuits.
However, it comes with challenges such as higher production costs and complex processes.
Despite these, as technology advances, HDI RIGID-FLEX PCB is set to play a crucial role in diverse industries.
HDI RIGID-FLEX PCB: Innovation at Its Best
The HDI RIGID-FLEX PCB is a game-changer in the world of circuits. It integrates the strength of rigid boards and the bendability of flex ones.
With precise manufacturing, it ensures optimal performance. It's widely used in areas like consumer electronics and medical devices.
In consumer electronics, it enables thinner and more functional devices. In medical, it meets the specific needs of portable equipment.
Though it has higher production demands and costs, its potential is huge. It will continue to drive technological progress.
Key Capabilities:
Flex Section which is almost simliar with Multilayer Felx.
Multilayer circuits-from 1 to 10 layers
Min LW/LS: 4mil/4mil
Adhesive-based and adhesiveless constructions, including thermoplastic and thermoset stiffener attachment.
Polyimide substrates: 1/2mil – 4mil
Copper: 1/3OZ – 2OZ, RA or ED type
Stiffeners include Polyimide (0.075-0.20mm), FR4 (0.15-2.0mm), and punched or formed metal parts (0.075-1.0mm)
Low-cost, conventional fabrication and lamination completed with PTH based plating
Screened inks, photo-imageable soldermasks, or laminated coverlay dielectrics
Surface finishes: ENIG, electroplated nickel/gold, immersion silver, tin,
EMI Shielding
HDI Rigid Section
HDI Rigid Section:
No. | Item | Key Features | Standard | Advanced |
1 | Layers | 20 | 32 | |
2 | Min line/space(mm) | Inner layer (HOZ) | 0.050/0.050 | 0.045/0.045 |
Outer layer(35-45μm) | 0.064/0.064 | 0.064/0.064 | ||
3 | Finished Thickness | Max (mm) | 4.2 | 4.5 |
Min (mm) | 0.2 | 0.2 | ||
4 | Dielectric thickness | Min thickness (mm) | 0.05 | 0.05 |
5 | Stack-up | Build-up | 5+N+5 | Any layer |
Sequential Lam | 18+2+18 | 20+20 | ||
6 | Blind hole | Filled via Diameter (mm) | 0.15 | 0.18 |
Dimple /μm | ≤10 | ≤10 | ||
Non-filled via diameter(mm) | 0.076 | 0.05 | ||
Aspect ratio | 1.1:1 | 1.2:1 | ||
Skip via diameter | 0.2 | 0.2 | ||
Size of Target PAD | D+0.15mm | D+0.125mm | ||
7 | Line precision | Inner layer(HOZ) | ±8μm | ±6μm |
/μm | Inner layer(1OZ) | ±8μm | ±8μm | |
Outer layer(35-45μm) | ±20μm | ±15μm | ||
8 | Registration | Min. Pad Dia (DHS+X) | DHS+0.15mm | DHS+0.15mm |
Solder mask | 0.030mm | 0.025mm | ||
9 | VIPPO | Mass production | Mass production |
As a professional manufacturer of a multi-flex circuit(Multilayer FPC,Flexbile PCB,Rigid-flex PCB), boards in China, I-TECH can always make your circuit board dreams come true. Welcome to contact us anytime for inquiries about multi-layer flexible circuits.