HDI Rigid-Flex PCBs-PCB Manufacturer in China｜PCB Supplier in China｜Flex PCB｜FPC｜Rigid-Flex PCB

HDI Rigid- Flexible Circuits
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HDI RIGID-FLEX PCB combines the rigidity of traditional circuit boards with the flexibility of flex circuits. It consists of both rigid and flexible sections, allowing for complex designs and enhanced functionality.

This unique board structure uses advanced manufacturing techniques to ensure efficient signal transmission and reliable connections. Metalized holes and vias enable seamless communication between layers.

In applications like wearable devices, it offers a perfect fit and stable performance. For example, smartwatches benefit from its flexibility and compact design.

In automotive electronics, it withstands harsh conditions and provides reliable circuits.

However, it comes with challenges such as higher production costs and complex processes.

Despite these, as technology advances, HDI RIGID-FLEX PCB is set to play a crucial role in diverse industries.

HDI RIGID-FLEX PCB: Innovation at Its Best

The HDI RIGID-FLEX PCB is a game-changer in the world of circuits. It integrates the strength of rigid boards and the bendability of flex ones.

With precise manufacturing, it ensures optimal performance. It's widely used in areas like consumer electronics and medical devices.

In consumer electronics, it enables thinner and more functional devices. In medical, it meets the specific needs of portable equipment.

Though it has higher production demands and costs, its potential is huge. It will continue to drive technological progress.

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HDI Rigid-Flexible Circuits（HDI Rigid FPC,HDI Rigid-Flex PCB)

When To Use & Feature Of HDI Rigid-Flex PCB

Eliminating the challenges of traditional circuit board designs, HDI rigid-flex PCBs present distinct functional advantages in terms of enhanced signal integrity, superior heat dissipation, and more efficient space utilization. They also boast excellent mechanical properties such as high durability. Therefore, HDI rigid-flex PCBs are an excellent choice when the following purposes and characteristics are demanded:

Complex component integration
Minimization of signal interference
Power and ground distribution optimization
Used for high-frequency communication applications
Surface-mount assembly
Precisely controlled impedance
Up to 50 or more layers
Flexible regions for conformability in confined spaces
Increased interconnection density: HDI technology enables a high density of interconnections to save space and improve performance
High-density component placement
Other industry-specific performance requirements
Ideal for the automotive and medical device markets

Multi-Layer Flex Circuit Structure / Stack Up

Here is stack up for 8-layers HDI Rigid With Blind/Bury Hole+ 4 Layers flexible circuit:
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There are more complex interconnections, layer design, Via Hole design, surface mounting. Contact us to see more stacked HDI Rigid-flex circuits.

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HDI-Rigid-Flex Circuit Materials:

HDI Rigid-flex have via via hole design which is same as the HDI Rigid PCB, beaides it also allows for localized areas where stiffeners, pins, connectors, and components may be added, so the material is the same as double-sided flex circuits, all have core material, coverlay, stiffeners, PSA EMI/RF shielding.

Key Capabilities:

Flex Section which is almost simliar with Multilayer Felx.

Multilayer circuits-from 1 to 10 layers
Min LW/LS: 4mil/4mil
Adhesive-based and adhesiveless constructions, including thermoplastic and thermoset stiffener attachment.
Polyimide substrates: 1/2mil – 4mil
Copper: 1/3OZ – 2OZ, RA or ED type
Stiffeners include Polyimide (0.075-0.20mm), FR4 (0.15-2.0mm), and punched or formed metal parts (0.075-1.0mm)
Low-cost, conventional fabrication and lamination completed with PTH based plating
Screened inks, photo-imageable soldermasks, or laminated coverlay dielectrics
Surface finishes: ENIG, electroplated nickel/gold, immersion silver, tin,
EMI Shielding
HDI Rigid Section

HDI Rigid Section:

No.	Item	Key Features	Standard	Advanced
1	Layers		20	32
2	Min line/space(mm)	Inner layer (HOZ)	0.050/0.050	0.045/0.045
2	Min line/space(mm)	Outer layer（35-45μm）	0.064/0.064	0.064/0.064
3	Finished Thickness	Max (mm)	4.2	4.5
3	Finished Thickness	Min (mm)	0.2	0.2
4	Dielectric thickness	Min thickness (mm)	0.05	0.05
5	Stack-up	Build-up	5+N+5	Any layer
5	Stack-up	Sequential Lam	18+2+18	20+20
6	Blind hole	Filled via Diameter （mm）	0.15	0.18
		Dimple /μm	≤10	≤10
		Non-filled via diameter（mm）	0.076	0.05
		Aspect ratio	1.1:1	1.2:1
		Skip via diameter	0.2	0.2
		Size of Target PAD	D+0.15mm	D+0.125mm
7	Line precision	Inner layer(HOZ)	±8μm	±6μm
	/μm	Inner layer(1OZ)	±8μm	±8μm
		Outer layer（35-45μm）	±20μm	±15μm
8	Registration	Min. Pad Dia (DHS+X)	DHS+0.15mm	DHS+0.15mm
8	Registration	Solder mask	0.030mm	0.025mm
9	VIPPO		Mass production	Mass production

As a professional manufacturer of a multi-flex circuit(Multilayer FPC,Flexbile PCB,Rigid-flex PCB), boards in China, I-TECH can always make your circuit board dreams come true. Welcome to contact us anytime for inquiries about multi-layer flexible circuits.

HDI Rigid-Flex PCBs