The following are the professional terms used in the PCB manufacturing process, including both Chinese and English versions as well as their explanations:
- 印制电路板（Printed Circuit Board，PCB）：又称印刷电路板，是电子科技中不可或缺的电子部件，用于支撑电子元件并实现电气连接。（Also known as a printed circuit board, it is an indispensable electronic component in electronic technology, used to support electronic components and achieve electrical connections.）
- 覆铜箔层压板（Copper - Clad Laminate，CCL）：由绝缘基板和附着在其表面的铜箔组成，是制造PCB的基础材料。（Consists of an insulating substrate and copper foil attached to its surface, which is the basic material for manufacturing PCBs.）
材料相关
- 半固化片（Prepreg）：由树脂和增强材料组成，在层压过程中起粘结和绝缘作用。（Consists of resin and reinforcing materials and plays a bonding and insulating role in the lamination process.）
- 铜箔（Copper Foil）：用于形成PCB上的导电线路，具有良好的导电性和延展性。（Used to form the conductive lines on the PCB, with good electrical conductivity and ductility.）
- 玻璃纤维布（Glass Fiber Cloth）：作为增强材料，提高覆铜板的机械强度和电气性能。（As a reinforcing material, it improves the mechanical strength and electrical properties of the copper - clad laminate.）
设计相关
- 布线（Routing）：在PCB设计中，将电子元件的引脚通过导电线路连接起来，实现电路功能。（In PCB design, the pins of electronic components are connected by conductive lines to achieve circuit functions.）
- 间距（Clearance）：指PCB上不同导电图形之间的最小距离，用于保证电气绝缘和防止短路。（Refers to the minimum distance between different conductive patterns on the PCB, used to ensure electrical insulation and prevent short - circuits.）
- 差分对（Differential Pair）：由两根相互靠近、传输相反信号的导线组成，用于高速信号传输，能有效抑制电磁干扰。（Consists of two wires that are close to each other and transmit opposite signals, used for high - speed signal transmission and can effectively suppress electromagnetic interference.）
制造工艺相关
- 蚀刻（Etching）：通过化学或物理方法去除覆铜板上不需要的铜箔，形成所需的导电线路。（The unwanted copper foil on the copper - clad laminate is removed by chemical or physical methods to form the required conductive lines.）
- 阻焊层（Solder Mask）：是一种涂覆在PCB表面的绝缘涂层，用于防止焊接时焊料在不需要的地方附着，避免短路。（Is an insulating coating applied to the surface of the PCB to prevent the solder from adhering to unwanted areas during welding and avoid short - circuits.）
- 丝印层（Silkscreen）：用于在PCB表面印刷字符、图形等标识，方便安装和维修。（Used to print characters, graphics and other markings on the surface of the PCB to facilitate installation and maintenance.）
- 钻孔（Drilling）：在PCB上钻出各种安装孔和过孔，用于安装电子元件和实现不同层之间的电气连接。（Drill various mounting holes and vias on the PCB for installing electronic components and achieving electrical connections between different layers.）
- 层压（Lamination）：将多张半固化片和铜箔通过高温高压粘合在一起，形成多层PCB。（Multiple prepregs and copper foils are bonded together by high temperature and high pressure to form a multilayer PCB.）
检测与测试相关
- 绝缘电阻测试（Insulation Resistance Test）：测量PCB上不同导电部分之间的绝缘电阻，以确保电气绝缘性能良好。（Measure the insulation resistance between different conductive parts on the PCB to ensure good electrical insulation performance.）
- 耐压测试（Dielectric Withstand Voltage Test）：对PCB施加一定的电压，检测其在高压下的绝缘性能，防止发生击穿现象。（Apply a certain voltage to the PCB to test its insulation performance under high voltage and prevent breakdown.）
- 功能测试（Functional Test）：对PCB组装完成后的电路进行测试，检查其是否满足设计的功能要求。（Test the circuit after the PCB is assembled to check whether it meets the designed functional requirements.）
Others
- 加成法（Additive Process）：一种PCB制造方法，通过在绝缘基板上直接添加导电材料来形成电路，相比传统减成法更环保、精度更高。（A PCB manufacturing method that forms circuits by directly adding conductive materials to the insulating substrate. It is more environmentally friendly and has higher accuracy than the traditional subtractive process.）
- 减成法（Subtractive Process）：是常见的PCB制造方法，先在覆铜板上涂覆抗蚀剂，然后通过蚀刻去除不需要的铜箔，形成电路。（Is a common PCB manufacturing method. First, apply an etch - resist on the copper - clad laminate, and then remove the unwanted copper foil by etching to form the circuit.）
- 多层板（Multilayer Board）：由两层以上的导电层和绝缘层交替堆叠。（Consists of two or more conductive layers and insulating layers stacked alternately.）