Surface Finishing

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Surface Finishing

We provide ranges Surface Finishes, We Know-How to keep the best solderilbility for your soldering process,

HASL (Hot Air Leveling)/Lead Free Solder/Immersion Nickel / Gold/Heavy Gold/Deep Nickel Gold/Gold Tip Plating/OSP/SIPAD/Silver/White Tin/Carbon / Conductive Inks/Copper Plating Ceramic Substrates

For plated through hole boards, electroless copper is followed by electroplated copper. The electroplated copper is deposited onto the hole wall to an average thickness of 0.001 inch. During the plating process, external lines receive an average of 0.0012 inch of copper plating. This is in addition to the original (base) copper foil. All exposed circuitry after soldermask needs to be protected by one of the finishes listed below.

Hot Air Leveled Solder – HASL (Eutectic: 63% Tin – 37% Lead)

•Typical coating thickness: 30 µinch to 200 µinch, design dependent
• Excellent solderability
• 0.020 inch pitch capability
• 0.030 inch minimum board thickness capability
• Good shelf life

Hot Air Leveled – Lead Free

• Typical coating thickness: 30 µinch to 200 µinch, design dependent
• Good solderability
• 0.020 inch pitch capability
• 0.030 inch minimum board thickness capability
• Good shelf life

Tin Plating

• Typical thickness: 300 µinch tin
• Solderable surface
• Fair shelf life

Deep Nickel Plating

• Typical thickness: 200 µinch nickel
• Excellent corrosion resistance
• Excellent wear resistance, best for surface switches, on/off contacts
• Excellent shelf life

Automatic Gold Plating – Tabs

• Typical thickness: 30 to 50 µinch gold (99.7% Pure) over 200 µinch nickel
• Excellent corrosion resistance
• 130 to 220 Knoop hardness
• Excellent wear resistance, best for edge connectors
• Excellent shelf life

Electroless Nickel / Immersion Gold (99.9% Pure Gold)

• Typical thickness: 3 to 8 µinch gold over 100 µinch nickel
• Excellent corrosion resistance
• Good for aluminum wire bonding
• Excellent for fine pitch technology
• Board not subjected to thermal shock (such as HASL)
• Excellent solderability
• Excellent shelf life

Organic Solderability Preservative (OSP) or Anti-Tarnish

• Typical coating thickness: 8 µinch
• Good solderability
• Excellent surface coplanarity and hole size uniformity
• Used in fine pitch technology
• Board not subjected to thermal shock (such as HASL)
• Fair shelf life (12 months)

Here are some frequency FAQ. If you have any others queries, pls do not hestitate to contact us for Surfac finishing Know How

1.What is a PCB Surface Finish?


A PCB surface finish refers to a coating applied to the exposed copper of a printed circuit board. The surface finish fulfills several crucial functions, such as protecting the copper from oxidation, offering a solderable surface for components, and contributing to maintaining the overall performance and reliability of the PCB.


2.What are the common types of PCB Surface Finishes?


Common types of PCB surface finishes include HASL (Hot Air Solder Leveling), Lead-free HASL, ENIG (Electroless Nickel Immersion Gold), ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), Immersion Tin, Immersion Silver, OSP (Organic Solderability Preservatives), among others.


3.What are the factors to consider when choosing a PCB surface finish?


When choosing a PCB surface finish, factors such as the assembly process, cost, shelf life, number of reflow cycles, lead-free requirements, environmental conditions, and the end-use application of the PCB should be taken into account.


4.What is HASL and what are its advantages and disadvantages?


HASL is a commonly employed surface finish that provides a reliable and solderable surface. However, it can result in uneven surfaces and is not suitable for fine-pitch components. Lead-free HASL is an alternative to comply with RoHS regulations.


5.What is ENIG and when is it used?


ENIG is a widely utilized surface finish known for its flat surface, good oxidation resistance, and suitability for fine-pitch components. Nevertheless, it can be more costly compared to HASL.


6.What is OSP and what are its benefits?


OSP is a cost-effective finish that provides a very flat surface, making it ideal for PCBs with fine-pitch components. However, it is not as robust for multiple reflow or assembly processes.

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