We provide ranges Surface Finishes, We Know-How to keep the best solderilbility for your soldering process,
HASL (Hot Air Leveling)/Lead Free Solder/Immersion Nickel / Gold/Heavy Gold/Deep Nickel Gold/Gold Tip Plating/OSP/SIPAD/Silver/White Tin/Carbon / Conductive Inks/Copper Plating Ceramic Substrates
For plated through hole boards, electroless copper is followed by electroplated copper. The electroplated copper is deposited onto the hole wall to an average thickness of 0.001 inch. During the plating process, external lines receive an average of 0.0012 inch of copper plating. This is in addition to the original (base) copper foil. All exposed circuitry after soldermask needs to be protected by one of the finishes listed below.
Hot Air Leveled Solder – HASL (Eutectic: 63% Tin – 37% Lead)
•Typical coating thickness: 30 µinch to 200 µinch, design dependent
• Excellent solderability
• 0.020 inch pitch capability
• 0.030 inch minimum board thickness capability
• Good shelf life
Hot Air Leveled – Lead Free
• Typical coating thickness: 30 µinch to 200 µinch, design dependent
• Good solderability
• 0.020 inch pitch capability
• 0.030 inch minimum board thickness capability
• Good shelf life
Tin Plating
• Typical thickness: 300 µinch tin
• Solderable surface
• Fair shelf life
Deep Nickel Plating
• Typical thickness: 200 µinch nickel
• Excellent corrosion resistance
• Excellent wear resistance, best for surface switches, on/off contacts
• Excellent shelf life
Automatic Gold Plating – Tabs
• Typical thickness: 30 to 50 µinch gold (99.7% Pure) over 200 µinch nickel
• Excellent corrosion resistance
• 130 to 220 Knoop hardness
• Excellent wear resistance, best for edge connectors
• Excellent shelf life
Electroless Nickel / Immersion Gold (99.9% Pure Gold)
• Typical thickness: 3 to 8 µinch gold over 100 µinch nickel
• Excellent corrosion resistance
• Good for aluminum wire bonding
• Excellent for fine pitch technology
• Board not subjected to thermal shock (such as HASL)
• Excellent solderability
• Excellent shelf life
Organic Solderability Preservative (OSP) or Anti-Tarnish
• Typical coating thickness: 8 µinch
• Good solderability
• Excellent surface coplanarity and hole size uniformity
• Used in fine pitch technology
• Board not subjected to thermal shock (such as HASL)
• Fair shelf life (12 months)